Conference
Thermal-Hydraulic Characterisation of Electronics Cooling Liquids: A Case Study of Jet Impingement Coldplate on Emulated CPU
Abstract
Authors
Murray G; Elliott JW; Jenkins R; Lebon MT; Byrne G; Robinson AJ
Volume
00
Pagination
pp. 1-4
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 30, 2022
DOI
10.1109/therminic57263.2022.9950634
Name of conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)