Conference
Design and characterization of a sealed hybrid-cooled high performance computing server
Abstract
This paper presents a novel 1U sealed design of high performances compute server using of jet impingement liquid cooling to cool the high power density components (CPU and GPUs. The system is studied using CFD simulations of both the liquid coolant loop and the recirculated air used to cool the peripheral components, showing good agreement with the experimental results with 52°C above ambient temperature measured on the CPU for the experimental …
Authors
Lebon M; Battaglioli S; Jenkins R; Parry I; Robinson AJ
Volume
00
Pagination
pp. 1-4
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 30, 2022
DOI
10.1109/therminic57263.2022.9950654
Name of conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)