Conference
DEVELOPMENT OF A HIGH-ACCURACY THERMAL INTERFACE MATERIAL TESTER
Abstract
Authors
Kempers R; Kolodner P; Lyons A; Robinson AJ
Pagination
pp. 221-226
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
May 1, 2008
DOI
10.1109/itherm.2008.4544274
Name of conference
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Conference proceedings
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
ISSN
1087-9870