Development of a naturally aspired thermosyphon for power amplifier cooling

This paper details the early development steps of a two-phase thermosyphon thermal management solution for power amplifiers (PA) in the telecommunication industry. These components, attached to a vertical PCB within an enclosure between the RF filter and a natural or forced convection heat sink, dissipate a large amount of heat with a high heat flux density. Currently cooled by direct contact to a shared heat sink, they tend to spread heat …