Conference
A New Hybrid Heat Sink with Impinging Micro-Jet Arrays and Microchannels Fabricated Using High Volume Additive Manufacturing
Abstract
This work describes the design of a high-performance water cooled micro heat sink for thermal management of high heat flux microelectronics. The design process leverages advances in additive manufacturing to produce flow channels and composite material structures that are not possible with traditional machining processes. The micro heat sink was designed with microchannels and an array of fins with integrated microjets (FINJET™ architecture). …
Authors
Robinson AJ; Kempers R; Colenbrander J; Tan W; Chen R; Bushnell N
Pagination
pp. 179-186
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2017
DOI
10.1109/semi-therm.2017.7896927
Name of conference
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)