Conference
Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire
Abstract
Authors
Lee J; Mayer M; Zhou Y; Persic J
Pagination
pp. 725-730
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
December 1, 2007
DOI
10.1109/eptc.2007.4469818
Name of conference
2007 9th Electronics Packaging Technology Conference