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Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire
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Overview
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Additional Document Info
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Overview
authors
Lee, J
Mayer, M
Zhou, Norman
Persic, J
status
published
publication date
December 2007
published in
2007 9th Electronics Packaging Technology Conference
Journal
presented at event
2007 9th Electronics Packaging Technology Conference
Conference
Research
keywords
40 Engineering
49 Mathematical Sciences
4901 Applied Mathematics
Identity
Digital Object Identifier (DOI)
10.1109/eptc.2007.4469818
Additional Document Info
start page
725
end page
730