PCB Embedded Chip-on-Chip Packaging of A 48 kW SiC MOSFET DC-AC Module with Double-Side Cooling Design Conferences uri icon

  •  
  • Overview
  •  
  • Research
  •  
  • Identity
  •  
  • Additional Document Info
  •  
  • View All
  •  

publication date

  • June 2020