PCB Embedded Chip-on-Chip Packaging of A 48 kW SiC MOSFET DC-AC Module with Double-Side Cooling Design

Packaging technology is a major challenge to tapping the performance potential of wide bandgap devices. This paper proposes a packaging design based on the printed circuit board embedded technology, chip-on-chip concept, and pressure-based contact. A silicon carbide DC-AC power module with 800V maximum voltage and 48kW continuous power is designed, which has an ultra-tiny volume dimensioned with 90 mm length, 40 mm width, and 3 mm thickness. By …