MODELLING THE STEADY STATE AND TRANSIENT RESPONSE OF THERMOCOUPLE ASSEMBLIES IN SOLIDS.

Uncertainty of temperature measurements in solids, using thermocouples, was investigated for two improved thermocouple instrumenting techniques. The temperature measurement error was determined numerically by a detailed simulation of the thermocouple/well assembly positioned in a substrate. Both techniques gave relatively low temperature measurement errors and these errors could be further reduced by proper design of the thermocouple/well assembly. The steady state and transient responses of the thermal disturbance were also compared.