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Parallel Electroplating of Multiple Materials...
Conference

Parallel Electroplating of Multiple Materials Using Patterned Gels for Electrochemical Sensing

Abstract

Electrodeposition is a widely used method to fabricate electrodes in microscale electroanalytical devices. In this method, low cost materials such as copper are coated with higher cost but functional materials such as gold or silver. Conventional methods of electroplating, which use a sequential process of coating one material at a time, consumes a significant amount of time for deposition of multiple materials. In addition, they use a large …

Authors

Mohammadzadeh A; Fox-Robichaud AE; Selvaganapathy PR

Volume

00

Pagination

pp. 1-4

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

October 30, 2019

DOI

10.1109/sensors43011.2019.8956829

Name of conference

2019 IEEE SENSORS