Conference
Bonding mechanism in ultrasonic gold ball bonds on copper substrate
Abstract
The effects of process parameters on bond formation in thermosonic gold ball bonding on a copper substrate at ambient temperatures have been investigated with scanning electron microscopy (SEM). A model was developed based on classical microslip theory to explain the general phenomena observed in the evolution of bond footprints left on the substrate. The specific effects of ultrasonic energy and complex stress distributions arising from tool …
Authors
Lum I; Jung JP; Zhou Y
Volume
36
Pagination
pp. 1279-1286
Publisher
Springer Nature
Publication Date
May 2005
DOI
10.1007/s11661-005-0220-2
Conference proceedings
Metallurgical and Materials Transactions A
Issue
5
ISSN
1073-5623