Bonding mechanism in gold wire crescent bonding

The bonding mechanism is gold wire crescent bonding was analyzed. The bonder was powered on for at least thirty minutes prior to bonding in order to ensure thermal stabilization. The bond with a peel force that was close to the average value of ten samples under each combination of bonding parameter was selected for detailed study of morphological features of the footprints left on the substrates using scanning electron microscopy (SEM). It was observed that metallurgical bonding mainly initiated at the lateral peripheral regions of the wire bonds in the absence of any ultrasonic energy.