On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires Conferences

abstract

• In order to eliminate the chip cratering for copper wire applications in IC packaging, it is worthwhile to develop new Cu wire chemistries to obtain a soft copper wire with a soft free-air ball (FAB). The conventional hardness characterization of a new bonding wire is a labour intensive, time-consuming work. Therefore an on-line hardness characterization method is presented that enables the hardness comparison of a larger number of different wires within a shorter time. The influences of capillary change, bonding substrate metallization and temperature on this method is quantified. It is found these influences need to be held constant during a hardness comparison study. With this method, the wire and FAB hardness comparison of nine novel 2-mil copper bonding wires, Cu 1 to Cu 9, and one 2-mil Au wire are performed. The wire hardness (wireside) and FAB hardness are characterized. It is found that the Cu 4 and Cu 5 have the softest wireside hardness and FAB hardness.

authors

• Hang, CJ
• Lum, I
• Lee, J
• Mayer, M
• Zhou, Norman
• Wang, CQ
• Hong, SJ
• Lee, SM

status

• published 

publication date

• January 1, 2007

published in

• ASME 2007 InterPACK Conference, Volume 1  Journal

presented at event

• ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference  Conference

keywords

• 40 Engineering
• 4014 Manufacturing Engineering

Digital Object Identifier (DOI)

• 10.1115/ipack2007-33046

International Standard Book Number (ISBN) 10

• 0791842770

International Standard Book Number (ISBN) 13

• 9780791842775

start page

• 25

end page

• 30

volume

• 1