Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process Conferences

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authors

Tian, Yanhong
Hang, Chunjin
Wang, Chunqing
Zhou, Norman

status

published

publication date

August 2007

published in

2007 8th International Conference on Electronic Packaging Technology Journal

presented at event

2007 8th International Conference on Electronic Packaging Technology Conference