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High integrity interconnection of silver...
Journal article

High integrity interconnection of silver submicron/nanoparticles on silicon wafer by femtosecond laser irradiation

Abstract

Welding of nanomaterials is a promising technique for constructing nanodevices with robust mechanical properties. To date, fabrication of these devices is limited because of difficulties in restricting damage to the nanomaterials during the welding process. In this work, by utilizing very low fluence (∼900 μJ cm(-2)) femtosecond (fs) laser irradiation, we have produced a metallic interconnection between two adjacent silver (Ag) …

Authors

Huang H; Sivayoganathan M; Duley WW; Zhou Y

Journal

Nanotechnology, Vol. 26, No. 2,

Publisher

IOP Publishing

Publication Date

January 16, 2015

DOI

10.1088/0957-4484/26/2/025303

ISSN

0957-4484