Toggle navigation
Home
People
Departments
Research
About
Login
Search
Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging
Conferences
Overview
Additional Document Info
View All
Overview
authors
Zou, G
Yan, J
Wang, X
Mu, F
Bai, H
Wu, A
Hu, A
Zhou, Norman
status
published
publication date
December 1, 2011
published in
Materials Science and Technology Conference and Exhibition 2011 MS and T 11
Journal
Additional Document Info
start page
1532
end page
1538
volume
2