Conference
Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm
Abstract
Authors
Lo JF; Fang Q; Marcu L; Kim ES
Pagination
pp. 715-718
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2007
DOI
10.1109/memsys.2007.4433086
Name of conference
2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)
Conference proceedings
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN
1084-6999