Cu Grain Growth in Damascene Narrow Trenches Conferences

authors

• Maitrejean, Sylvain
• Carreau, Vincent
• Thomas, Olivier
• Labat, Stéphane
• Kaouache, Belkhiri
• Verdier, Marc
• Lepinoux, Joel
• Brechet, Yves
• Legros, Marc
• Douin, Joel
• Brandstetter, Stefan
• Cayron, Cyril
• Sicardy, Olivier
• Weygand, Daniel
• Dubreuil, Olivier
• Normandon, Philippe
• Ho, Paul S
• Zschech, Ehrenfried
• Ogawa, Shinichi

status

• published 

publication date

• 2009

published in

• AIP Conference Proceedings  Journal

presented at event

• STRESS-INDUCED PHENOMENA IN METALLIZATION: Tenth International Workshop on Stress-Induced Phenomena in Metallization  Conference

keywords

• BOUNDARY
• COPPER
• Cu
• DIFFUSION
• ELECTRICAL-RESISTIVITY
• EVOLUTION
• INTERCONNECTS
• Interconnects
• LINE
• MECHANISM
• MICROSTRUCTURE
• Physical Sciences
• Physics
• Physics, Applied
• Science & Technology
• THIN-FILMS
• grain growth

Digital Object Identifier (DOI)

• 10.1063/1.3169253

International Standard Book Number (ISBN) 13

• 978-0-7354-0680-3

start page

• 135

end page

• +

volume

• 1143

issue

• 1