Conference
High Strength and Electrical Conductivity of UFG Copper Alloys
Abstract
Copper based materials are still the most attractive low resistivity materials for microelectronics and electrotechnics applications, though, all variants developed to combine strength and conductivity, such as solid solutions and composites, suffer from decay in electric conductivity while strength is increased . In a addition, linear decay was also conjectured for pure copper when grain size is refined below the UFG and nanostructured domains …
Authors
Champion Y; Couzine JP; Nenez ST; Bréchet Y; Islamgaliev RK; Valiev R
Volume
667-669
Pagination
pp. 755-759
Publisher
Trans Tech Publications
Publication Date
February 28, 2011
DOI
10.4028/www.scientific.net/msf.667-669.755
Conference proceedings
Materials Science Forum
ISSN
0255-5476