Effect of CH4 plasma on porous dielectric modification & pore sealing for advanced interconnect technology nodes Conference Paper uri icon

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authors

  • Aimadeddine, M
  • Arnal, V
  • Roy, D
  • Farcy, A
  • David, T
  • Chevolleau, T
  • Posseme, N
  • Vitiello, J
  • Chapelon, LL
  • Guedj, C
  • Brechet, Yves
  • Volpi, F
  • Torres, J

publication date

  • January 1, 2006