Bridging‐Stress Evaluation in a Ni/Al2O3 System via the Digital Image‐Correlation Technique

The bridging‐stress opening‐displacement relation of a nickel layer in an alumina sandwich has been determined experimentally using the digital image correlation (DIC) technique. The strain development in the ligament during extension was recorded, revealing three distinct zones. DIC proved to be a simple and accurate method to characterize deformation of the single Ni ligament during deformation.