Million-Line Failure Distributions for Narrow Interconnects Conferences

abstract

• ABSTRACTWe examine the distribution of failure times in a simple and computationally efficient, yet reasonably authentic, model of interconnect reliability that allows consideration of statistically significant samples. The model includes an approximate description of the distribution of grain sizes and texture in narrow interconnects, an effective treatment of stress evolution associated with mass transport along grain boundaries, and local relaxation of stresses due to void formation. Failure time distributions for populations of idealized structures are analyzed to aid in interpretation of model behavior.

authors

• Bartelt, MC
• Hoyt, Jeffrey
• Bartelt, NC
• Dike, JJ
• Wolfer, WG

status

• published 

publication date

• 1997

published in

• Materials Research Society Symposium - Proceedings  Journal

presented at event

• Symposium on Thin-Films - Stresses and Mechanical Properties VII at the MRS Fall Meeting  Conference

keywords

• Materials Science
• Materials Science, Coatings & Films
• Materials Science, Multidisciplinary
• Science & Technology
• Technology

Digital Object Identifier (DOI)

• 10.1557/proc-505-123

International Standard Book Number (ISBN) 10

• 1-55899-410-6

start page

• 123

end page

• 130

volume

• 505