Development and characterization of an electroplated copper nickel alloy-platinum micro-thermocouple

A cost effective electrodeposition technique was developed to microfabricate copper nickel alloy (CuNi)-platinum micro thermocouples. A flat smooth silicon wafer with a 9000 Å layer of oxide was chosen as the substrate material. Gold was used for the thermocouple electroplating base because of its high resistance to electrochemical corrosion and oxidation. Since gold does not adhere to the silicon substrate, a chromium layer was deposited as a …