Changes in the defect structure in carbon rich
a-SiC:H films deposited on various substrates using ditertiary butyl silane were investigated as a function of thermal treatment. Films grown at high deposition rates exhibit hydrogen trapped in voids. The incorporation of CHn, groups is thought to be the origin for these microvoids. With increasing annealing temperature the effusion of CHn, groups as determined by thermal desorption experiments promotes void growth which was studied using a variable energy positron beam. At annealing temperatures above 600 °C the films densify due to the breaking of C-H bonds and the formation of additional C-C bonds when the voids anneal out.