authors Chao-Chyun An Shyh-Ming Chang Ming-Yao Chen Kuo-Shu Kao Tsang, Jennifer Sheng-Shu Yang Chih Chen Chung-Kuang Lin Ren-Haw Chen Wen-Chih Chen
presented at event 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference
keywords Engineering Engineering, Electrical & Electronic Materials Science Materials Science, Multidisciplinary Science & Technology Technology