Journal article
Bonding stress measurements from the degree of polarization of facet emission of AlGaAs superluminescent diodes
Abstract
Mechanical stress induced by bonding AlGaAs superluminescent diodes to Cu, SiC, or diamond heat sinks using 40% Pb-60% Sn or 80% Au-20% Sn solder has been observed using measurements of the degree of polarization of the facet emission at low current levels. Stresses up to 10/sup 9/ dyn/cm/sup 2/ were observed, with the magnitude of the stress dependent on the solder used, and the sign of the stress dependent on the difference in thermal …
Authors
Colbourne PD; Cassidy DT
Journal
IEEE Journal of Quantum Electronics, Vol. 27, No. 4, pp. 914–920
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
April 1991
DOI
10.1109/3.83326
ISSN
0018-9197