Integrated packaging and topology optimization considering non-structural components and assembly feasibility

This paper presents a novel method for Integrated Packaging and Topology Optimization (IPTO) that simultaneously considers component layout and the topology of the supporting mounting structure in complex assembly systems. The proposed method introduces techniques to account for part-dependent loading from non-structural components and ensures assemblability within a topology-optimized structure. The proposed method allows components to move during the formation of the mounting structure, enabling better positioning and shared structural support. Two case studies validate the effectiveness of the method: an academic example and a drone design. In the academic case study, the simultaneous optimization of component layout and mounting design reduced compliance by 90.6% compared to the benchmark design, resulting in a stiffer and more efficient design. In the drone case study, the method achieves a 41.2% lower compliance value than the benchmark. While demonstrating significant advantages, the method faces limitations in computational efficiency and dependence on initial conditions. Future work aims to address these issues through advanced optimization algorithms and to extend the method to accommodate more complex loading scenarios. The findings highlight the potential of simultaneous topology and packaging optimization to improve structural performance in complex engineering systems.