Journal article
Sequential environmental stresses tests qualification for automotive components
Abstract
The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature. It is based on the acceleration of failure mechanisms like ball bond lift (due to intermetallic Au–Al thickness growth), by combination of environmental stresses. The delamination measurement was used as an indicator of potential assembly weaknesses. An optimized package sequential …
Authors
Bahi MA; Lecuyer P; Fremont H; Landesman J-P
Journal
Microelectronics Reliability, Vol. 47, No. 9-11, pp. 1680–1684
Publisher
Elsevier
Publication Date
September 2007
DOI
10.1016/j.microrel.2007.07.004
ISSN
0026-2714