Journal article
Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification
Abstract
Several package families used in automotive environment were aged at different high temperatures. The purpose was to better characterize the predominant failure mechanism of ball bonds and to identify the most influential technological parameters on it. The mechanism is related to the Kirkendall effect, which is a consequence of the Au–Al intermetallic phase growth. For identical materials, the package geometry plays a crucial role: …
Authors
Bahi MA; Lecuyer P; Gentil A; Fremont H; Landesman J-P; Christien F; Le Gall R
Journal
IEEE Transactions on Device and Materials Reliability, Vol. 8, No. 3, pp. 484–489
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
September 1, 2008
DOI
10.1109/tdmr.2008.2001703
ISSN
1530-4388