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Degradation Mechanisms of Au–Al Wire Bonds During...
Journal article

Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

Abstract

Several package families used in automotive environment were aged at different high temperatures. The purpose was to better characterize the predominant failure mechanism of ball bonds and to identify the most influential technological parameters on it. The mechanism is related to the Kirkendall effect, which is a consequence of the Au–Al intermetallic phase growth. For identical materials, the package geometry plays a crucial role: …

Authors

Bahi MA; Lecuyer P; Gentil A; Fremont H; Landesman J-P; Christien F; Le Gall R

Journal

IEEE Transactions on Device and Materials Reliability, Vol. 8, No. 3, pp. 484–489

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

September 1, 2008

DOI

10.1109/tdmr.2008.2001703

ISSN

1530-4388