Journal article
A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling
Abstract
In this paper, two single-phase liquid cooling strategies for electronics thermal management are compared and contrasted; impinging jet arrays and laminar flow in microchannels. The comparison is posed for a situation in which an electronic device must dissipate 250 W/cm2 while being maintained at a temperature of 85 °C. The calculations indicate that both the impinging jet and microchannel heat sinks can provide the necessary cooling with less …
Authors
Robinson AJ
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 32, No. 2, pp. 347–357
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
June 1, 2009
DOI
10.1109/tcapt.2008.2010408
ISSN
2156-3950