Journal article
Lamination Scheme of Curing Degree at Multiple Levels of Temperature With Location-Scale Regression
Abstract
Authors
Tsai C-C; Lin C-T; Balakrishnan N
Journal
IEEE Access, Vol. 9, , pp. 50163–50169
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2021
DOI
10.1109/access.2021.3068996
ISSN
2169-3536