Journal article
The Feasibility of Au Ball Bonding on Sn-Plated Cu
Abstract
The feasibility of thermosonic gold wire bonding on Cu coupons with Sn/Cu metallizations was studied by evaluating shear strength and microstructure of balls bonded on different Sn metallization samples. The 0.85 ± 0.08 μm and 5.34 ± 0.21 μm thick metallizations were produced by dipping the Cu coupon in 250°C molten Sn solder for 1 s (sample 1) and 30 s (sample 2), respectively. Cu6Sn5 intermetallic compounds are formed during dipping. After …
Authors
Lee J; Mayer M; Zhou Y
Journal
Journal of Electronic Materials, Vol. 36, No. 6, pp. 682–689
Publisher
Springer Nature
Publication Date
June 2007
DOI
10.1007/s11664-007-0121-9
ISSN
0361-5235