An Experimental Study of Transient Liquid Phase Bonding of the Ternary Ag-Au-Cu System Using Differential Scanning Calorimetry

An experimental approach using differential scanning calorimetry (DSC) has been applied to quantify the solid/liquid interface kinetics during the isothermal solidification stage of transient liquid phase (TLP) bonding in an Ag-Au-Cu ternary alloy solid/liquid diffusion couple. Eutectic Ag-Au-Cu foil interlayers were coupled with pure Ag base metal to study the effects of two solutes on interface motion. Experimental effects involving baseline …