Journal article
Evaluation of Titanium Direct Bonding Mechanism
Abstract
Direct metal bonding represents an advanced joining technology that allows vertical stacking with electrical conduction and even heat dissipation. For most metals used as bonding layers, direct bonding when operating under ambient conditions involves metal oxides. The bonding interface saddles with a trapped oxide layer that might affect electrical conduction and even complete sealing of bonding interface. Titanium especially because of its …
Authors
Baudin F; Delaye V; Guedj C; Chevalier N; Mariolle D; Imbert B; Fabbri JM; Di Cioccio L; Bréchet Y
Journal
ECS Journal of Solid State Science and Technology, Vol. 2, No. 5, pp. n115–n119
Publisher
The Electrochemical Society
Publication Date
2013
DOI
10.1149/2.015305jss
ISSN
2162-8769