Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging

Ag or Cu metal nanoparticle paste can be used as a bonding material for electronic packaging applications. However, Ag nanoparticle paste has some drawbacks including high cost and being prone to ion migration in high-humidity conditions. The main obstacle to using Cu nanoparticle paste is rapid oxidation in air during heating. In this work, we describe a method to prepare Ag-Cu alloy nanoparticle paste by a polyol chemical reduction method …