Journal article
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper
Abstract
Silver nanoparticle (NP) paste was fabricated and used to bond copper wire to copper foil at low temperatures down to 160°C. The silver NP paste was developed by increasing the concentration of 50 nm silver NP sol from 0.001 vol.% to 0.1 vol.% by centrifugation. The 0.001 vol.% silver NP sol was fabricated in water by reducing silver nitrate (AgNO3) using sodium citrate dihydrate (Na3C6H5O7·2H2O). The bond was formed by solid-state sintering …
Authors
Alarifi H; Hu A; Yavuz M; Zhou YN
Journal
Journal of Electronic Materials, Vol. 40, No. 6, pp. 1394–1402
Publisher
Springer Nature
Publication Date
June 2011
DOI
10.1007/s11664-011-1594-0
ISSN
0361-5235