Journal article
Golden bump for 20micron diameter wire bond enhancement at reduced process temperature
Abstract
With the rapid development of advanced microelectronic packaging technologies, research on fine-pitch wire bonding with improved reliability is driven by demands for smaller form factors and higher performance. In this study, thermosonic wire bonding process with a 20μm wire for fine-pitch interconnection is described. To strengthen stitch bonds made in a gold–silver bonding system when the bonding temperature is as low as 150°C, ball bumps …
Authors
Nan C; Mayer M; Zhou N; Persic J
Journal
Microelectronic Engineering, Vol. 88, No. 9, pp. 3024–3029
Publisher
Elsevier
Publication Date
September 2011
DOI
10.1016/j.mee.2011.05.001
ISSN
0167-9317