Journal article
On resonant effects in multilayer RF/microwave printed circuit board applications
Abstract
Authors
Georgieva N; Chen Z; Oberhammer W
Journal
IEEE Transactions on Advanced Packaging, Vol. 22, No. 2, pp. 200–206
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
December 1, 1999
DOI
10.1109/6040.763192
ISSN
1521-3323