Journal article
Cavity Models of Planar Components Grounded by Via-Holes and Their Experimental Verification
Abstract
Authors
Kouzaev GA; Deen MJ; Nikolova NK; Rahal AH
Journal
IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 3, pp. 1033–1042
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
March 1, 2006
DOI
10.1109/tmtt.2005.864137
ISSN
0018-9480