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Journal article

Laser ablation as a processing technique for metallic and polymer layered structures

Abstract

A study of the laser ablation process for application in processing metallic and polymer layered structures is presented. The central result of this study is that, by operating with laser pulses of different fluences, it is possible to selectively remove polymer overlayers on metallic films and metallic films from polymer layers, provided the metallic films are sufficiently thin. Careful choice of the fluence allowed both of these processes to be carried out with minimal damage to the underlying material. The damage produced has been characterized by laser processing through visual inspection, profilometry, and electron microscopy. In the case of polymer layers, the effect of exposure to laser irradiation through spectroscopic studies in the infrared, visible, and ultraviolet portion of the spectrum has also been studied. For the metallic layers, we have correlated the visible damage observed with changes in the electrical resistivity of the films.<>

Authors

Guzzo EE; Preston JS

Journal

IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No. 1, pp. 73–78

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

January 1, 1994

DOI

10.1109/66.286834

ISSN

0894-6507

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