Journal article
Bonding Stress and Reliability of High Power GaAs-Based Lasers
Abstract
GaAs-based lasers were bonded to oxygen-free high-conductivity (OFHC) copper heat sinks using a eutectic PbSn solder or a silver-filled conductive epoxy, and life tested. Epoxy-bonded devices were observed to have a larger failure rate on life test than solder-bonded devices. Bonding stress, as measured by the degree of polarization (DOP) of photoluminescence, was found to be the largest in epoxy-bonded devices. As well, the type of heat sink …
Authors
Lisak D; Cassidy DT; Moore AH
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 24, No. 1,
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
March 2001
DOI
10.1109/6144.910807
ISSN
2156-3950