Journal article
Cooling Rate in Diode Laser Bonding
Abstract
Diode laser die bonding parameters were measured for the cases of slow cool and rapid cool die bonding processes. The thermal strain, solder composition and structure, thermal impedance, and bond strength of InP based diode lasers bonded to AlN chip carriers using pre-deposited Au–Sn solder were examined. Relative to the rapid cool process, the slow cool process was found on average: to induce greater strain in the laser chips; to exhibit a …
Authors
Fritz MA; Cassidy DT
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 27, No. 1, pp. 147–154
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
3 2004
DOI
10.1109/tcapt.2004.825749
ISSN
2156-3950