A technique for rapid characterization of intermetallics and interfaces

The production, testing and characterization of intermetallics is expensive and time consuming. In view of the wide range of intermetallics which need to be explored, the development of rapid and simple methods for classifying intermetallics is of importance. In the current work we will describe a method of producing layered or graded materials containing a sequence of intermetallics by controlled dissolution and solidification. The scale of the structure is such that hardness and toughness can be assessed by the use of microhardness indentation and, in addition, the properties of specific interfaces can be assessed. An example is shown for the copper–aluminum system where the sequence of intermetallics CuAl2, CuAl, Cu9Al4 can be created. Interfacial fracture between the CuAl2 (tetragonal phase) and the CuAl (monoclinic/orthorombic phase) has been observed and characterized by Atomic Force, Scanning and Transmission Electron Microscopes.