High strength and high electrical conductivity bulk Cu Journal Articles

authors

• Han ¶, K
• Walsh, RP
• Ishmaku, A
• Toplosky, V
• Brandao, L
• Embury, Johndavid

status

• published 

publication date

• December 2004

has subject area

• 01 Mathematical Sciences (FoR)
• 02 Physical Sciences (FoR)
• 09 Engineering (FoR)
• Materials (Science Metrix)

published in

• Philosophical Magazine  Journal

keywords

• ALLOYS
• COPPER SINGLE-CRYSTALS
• DEFORMATION
• EXTRUSION
• LARGE STRAINS
• MICROSTRUCTURE
• Materials Science
• Materials Science, Multidisciplinary
• Metallurgy & Metallurgical Engineering
• NANOCRYSTALLINE METALS
• NB COMPOSITE
• Physical Sciences
• Physics
• Physics, Applied
• Physics, Condensed Matter
• RESISTIVITY
• Science & Technology
• TENSILE DUCTILITY
• Technology

Digital Object Identifier (DOI)

• 10.1080/14786430412331293496

start page

• 3705

end page

• 3716

volume

• 84

issue

• 34