Helium nano-bubbles in copper thin films slows down creep under ion irradiation
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Overview
status
publication date
has subject area
published in
Research
keywords
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BEHAVIOR
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CHARACTERIZE
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Copper
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Creep
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DEPENDENCE
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DYNAMICS
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FCC METALS
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Helium bubbles
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Irradiation
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MECHANICAL-PROPERTIES
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MICROSTRUCTURE
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Materials Science
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Materials Science, Multidisciplinary
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Metallurgy & Metallurgical Engineering
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ODS STEEL
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STAINLESS-STEELS
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STRESS
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Science & Technology
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Small-scale testing
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Technology
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