Journal article
Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data
Abstract
Authors
Zhang W; Zhu X; He M; Balakrishnan N
Journal
IEEE Transactions on Reliability, Vol. 74, No. 3, pp. 3043–3055
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2025
DOI
10.1109/tr.2024.3509446
ISSN
0018-9529