Journal article
Interconnect for Dense Electronically Scanned Antenna Array Using High-Speed Vertical Connector
Abstract
We present the design and the performance evaluation of a new interconnect for large-scale densely packed electronically scanned antenna arrays that utilize a high-speed digital board-to-board vertical connector. The application targets microwave tissue, imaging in the frequency range from 3 GHz to 8 GHz. The tissue-imaging arrays consist of hundreds of active antenna elements, which require low-reflection, low-loss, and low-crosstalk …
Authors
Valizade Shahmirzadi N; Nikolova NK; Chen C-H
Journal
Sensors, Vol. 23, No. 20,
Publisher
MDPI
DOI
10.3390/s23208596
ISSN
1424-8220