Journal article
Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging
Abstract
This article proposes a methodology of analytical modeling and optimization of power modules, especially compatible with modules with silver-sintered molybdenum (SSM) packaging or other insulated metal substrate types of packaging schemes. First, a decoupled Fourier-based thermal model is presented, which considers the barrier effect between substrate segments. Compared with the original Fourier-based model, it reduces the average error from …
Authors
Yang Y; Zhou L; Zayed O; Alizadeh M; Stevanovic D; Narimani M; Emadi A
Journal
IEEE Transactions on Power Electronics, Vol. 38, No. 9, pp. 11277–11289
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
DOI
10.1109/tpel.2023.3281417
ISSN
0885-8993