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Minimal repair under a step-stress test
Journal article

Minimal repair under a step-stress test

Abstract

In the one- and multi-sample cases, in the context of life-testing reliability experiments, we introduce minimal repair processes under a simple step-stress test, based on exponential distributions and an associated cumulative exposure model, and then develop likelihood inference for such a model.

Authors

Balakrishnan N; Kamps U; Kateri M

Journal

Statistics & Probability Letters, Vol. 79, No. 13, pp. 1548–1558

Publisher

Elsevier

Publication Date

July 1, 2009

DOI

10.1016/j.spl.2009.03.020

ISSN

0167-7152

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