Journal article
Multiple-Stress Model for One-Shot Device Testing Data Under Exponential Distribution
Abstract
Authors
Balakrishnan N; Ling MH
Journal
IEEE Transactions on Reliability, Vol. 61, No. 3, pp. 809–821
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
September 1, 2012
DOI
10.1109/tr.2012.2208301
ISSN
0018-9529