Journal article
Comparison of Stress Properties in SiOx, SiNx, and SiOxNy Thin Films Grown by Inductively Coupled Plasma CVD
Authors
Wojcik J; Stortz G; Roschuk T; Mascher P
Journal
ECS Meeting Abstracts, Vol. MA2008-01, No. 21, pp. 774–774
Publisher
The Electrochemical Society
Publication Date
May 5, 2008
DOI
10.1149/ma2008-01/21/774
ISSN
2151-2043